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This represents Apple's biggest investment to date, aligning with its commitment made last year to invest $600 billion into the U.S. economy over a four-year period. This will enable the production of more than 15 billion chips in the US and create hundreds of jobs.
"Apple is collaborating with the government and American companies to create a complete semiconductor supply chain in the United States, and today's announcement further supports those initiatives," the press release stated.
Last year, President Donald Trump warned that he would implement a tariff of "at least 25%" on iPhones sold in the US if they were produced overseas.
The updated agreement consists of a $1.5 billion investment aimed at expanding and upgrading Broadcom's manufacturing sites in Fort Collins, Colorado, where the firm will produce advanced electronic parts and wireless communication technologies.
On Monday, Broadcom revealed that it has extended its technological partnership with Apple through 2031, whereby it will design and provide a variety of custom chips for multiple generations of its products. The chips will utilize an application-specific integrated circuit (ASIC) format, which is gaining popularity for developing components that handle AI processing tasks. The financial specifics of the agreement were not revealed.
source: wsj.com
"Apple is collaborating with the government and American companies to create a complete semiconductor supply chain in the United States, and today's announcement further supports those initiatives," the press release stated.
Last year, President Donald Trump warned that he would implement a tariff of "at least 25%" on iPhones sold in the US if they were produced overseas.
The updated agreement consists of a $1.5 billion investment aimed at expanding and upgrading Broadcom's manufacturing sites in Fort Collins, Colorado, where the firm will produce advanced electronic parts and wireless communication technologies.
On Monday, Broadcom revealed that it has extended its technological partnership with Apple through 2031, whereby it will design and provide a variety of custom chips for multiple generations of its products. The chips will utilize an application-specific integrated circuit (ASIC) format, which is gaining popularity for developing components that handle AI processing tasks. The financial specifics of the agreement were not revealed.
source: wsj.com
